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HP c7000 Three-Phase Enclosure with 6 Power Supplies and 6 Fans with 16 Insight Control Data Center Edition Licenses + 8x HP ProLiant BL465c Blade Servers DC 2.4GHz 2GB RAM1x 412136-B21 (HP c7000 Three-Phase Enclosure with 6 Power Supplies and 6 Fans with 16 Insight Control Data Center Edition Licenses) 8x 407234-B21 (HP BL465c Blade Server with Dual-Core 2.4GHz and 2GB Memory)HP ProLiant BL465c Specifications: HP ProLiant BL465c 2216 HE DC, 2GB (1P) 407234-B21Processor(s): (1) Low Power AMD Opteron processor Model 2216 HE (2.4 GHz) Dual-Core Cache Memory: 1MB Level 2 cache memory per core Memory: 2 GB (2 x 1 GB) PC2-5300, Registered DDR2-667 Network Adapter: Two (2) embedded NC370i Multifunction Gigabit Server Adapters plus one (1) additional 10/100 server adapter dedicated to iLO 2 management Storage Controller: Smart Array E200i Controller with 64MB (optional battery-backed write cache) Hard Drives: No drives included; (2) SFF SAS/SATA drive bays Optical Drive: None ship standard Form Factor: Up to 16 half-height blades supported in HP BladeSystem c7000 Enclosure HP c7000 Three-Phase Enclosure Specifications: HP BladeSystem is the evolution of the entire rack-mounted infrastructure. A BladeSystem reduces costs and simplifies the management, building, and maintenance of the infrastructure behind your multi-server environment. It consolidates and repackages all the supporting infrastructure elements-compute, storage, network, and power into a single platform that can accelerate the integration and optimization of your data center. With the flexibility to scale from a single enclosure holding up to 16 blades, to a rack containing 4 enclosures holding up to 64 blades, the c-Class infrastructure is designed to meet the needs of today's businesses. An HP BladeSystem c-Class infrastructure is made up of several components:-ProLiant and Integrity Server blades for Windows, Linux, and HP UX. -Choice of Intel processors, including the latest dual-core processors for 32-bit and 64-bit applications. -HP BladeSystem c-Class enclosure that provides connectivity, power, and cooling options. The c-Class enclosure is designed for full redundancy and high availability. Redundant power, cooling, enclosure management, and interconnect modules are part of the standard enclosure design. -Onboard Administrator module which provides a single point of control for intelligent management of the entire enclosure. -Insight Display powered by the Onboard Administrator provides local management through an LCD display conveniently sited on the front of the system. -Ethernet, Fibre Channel, InfiniBand, iSCSI, and other interconnect choices -A power subsystem that provides redundant power modes and Dynamic Power Saving mode, which uses up to 22% less power than traditional rack-mounted servers. -PARSEC (Parallel, Redundant, Scaleable, Enclosure Cooling) architecture: for maximum cooling that consumes less power and reduces datacenter noise. -Direct-attach storage blades, or future shared storage blades, which will provide block-based shared storage capacity for the server blades in the enclosure.
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